At RRP Electronics, our state-of-the-art semiconductor manufacturing facility is designed to deliver the highest quality and precision in every step of the production process.
Services
Front of Line
Incoming Wafers Bank
Secure storage and meticulous management of incoming semiconductor wafers to ensure they are kept in optimal conditions before processing.
Detaping
Removing protective tape to prepare the wafers for further processing, ensuring no residue affects the quality.
Die Attach/Bonding
Attaching and bonding of semiconductor dice to their respective substrates to ensure strong and reliable connections.
Plasma Cleaning
Advanced plasma cleaning techniques to remove contaminants from the surfaces, ensuring a clean and reliable semiconductor product.
Optical Inspection (III)
Final optical inspection to ensure that all products meet stringent quality standards before they are dispatched, providing an additional layer of quality assurance.
Initial Quality Control
Rigorous inspection and testing of wafers upon arrival to verify their quality and suitability for further processing.
Wafer Tape Mounter & UV Curing
To enhance protection and maintain wafer integrity during handling reapplying protective tape to the wafer followed by UV curing.
Wire Bonding
Bonding fine wires between the semiconductor die and the external circuitry, crucial for electrical connectivity.
Wafer Taping and UV Curing
Applying protective tape to wafers followed by UV curing to safeguard the surface during subsequent manufacturing steps.
Wafer Sawing/Dicing
Cutting and dicing of the wafer into individual semiconductor chips with high precision to prepare for packaging and integration.
Die Shear Test
Testing the adhesion strength of the die to the substrate to confirm the reliability and durability of the attachment.
Wire Pull & Ball Shear Test
Testing the strength and integrity of wire bonds to ensure they meet reliability standards and perform as expected.
Wafer Back Grinding/Polishing
Precision grinding and polishing of backside of the wafer to achieve the desired thickness and smoothness, essential for performance.
Opticial Inspection (II)
Detailed optical inspection performed at this stage to identify and address any defects or irregularities in the semiconductor chips.
Epoxy Curing
Curing of epoxy resin used to secure and protect the die, ensuring long-term stability and protection of the semiconductor.
Cratering Test
Assessment of the semiconductor for any cratering issues to ensure the quality and reliability of the final product.
End of Line
Molding/Encapsulation
Encapsulation of semiconductor chips in protective molding compounds to shield them from environmental factors and mechanical stress, ensuring durability and functionality.
Laser Marking
Precision laser marking for identification, traceability, and branding purposes, providing clear and durable markings on the semiconductor packages.
Optical Inspection
Final optical inspection to verify the quality and appearance of the semiconductor packages, ensuring that they meet the highest standards before shipping.
Post Mold Curing
Curing of the molded encapsulation material to achieve optimal hardness and stability, enhancing the protective qualities and longevity of the semiconductor package.
Lead Frame Mounter & UV Curing
Mounting of lead frames onto the semiconductor package followed by UV curing to secure the frames and ensure proper alignment for electrical connections.
Tape & Reel Packing
Packaging of semiconductor units into tape-and-reel formats for easy handling and integration into automated assembly processes, providing convenience and protection during transport.
X-Ray Inspection
Advanced X-ray inspection to detect any internal defects or inconsistencies within the molded package, ensuring the integrity of the semiconductor.
Saw Singulation
Cutting of the semiconductor package into individual units using advanced sawing techniques, ensuring precise separation and minimal damage.
Vacuum Sealed Final Packing
Final packaging under vacuum-sealed conditions to protect the semiconductor products from moisture, contaminants, and physical damage, ensuring their quality and reliability upon delivery.
Buffing
Polishing and smoothing of the semiconductor package surface to achieve a high-quality finish and remove any imperfections.
Pick & Place - Packing
Automated or manual placement of individual semiconductor units into their packaging, ensuring careful handling and correct orientation for efficient packing.