Our Products

QFN Packages

  • Surface mount IC packages are commonly used in PCB assembly and come in various types.


  • The QFN (Quad Flat No-Lead) package is well-suited for consumer electronics, automotive designs, industrial applications, and power solutions.

Wettable Flank Plated QFN Packages

  • Automotive industry OEMs require 100% automatic visual inspections (AVI) post-assembly for safety and reliability.

  • QFN packages pose inspection challenges due to the lack of visible solderable terminals and potential oxidation on exposed copper edges.

  • This can lead to difficulties with sidewall solder wetting and varied solder coverage (50-90%), resulting in additional costs from yield issues and poor solder joints.

  • The wettable flank process provides a visual indicator of solderability, reducing inspection time and costs.

BGA Packages

  • The Ball Grid Array (BGA) is a popular choice for high I/O devices.

  • It offers advantages over other high lead-count packages (approximately 208 leads), such as eliminating lead bending issues and improving coplanarity.

  • RRP plans to establish a facility for manufacturing both PBGA (Plastic Ball Grid Array) and flip-chip BGAs.

Power Devices

  • Power modules are ideal for robust high-power switching applications.

  • These modules combine one or more high-power components, such as transistors and diodes, into a functional, isolated unit with a base plate for heat sink mounting and easy electrical connections.

  • They offer enhanced power handling, improved reliability, and reduced parasitic elements.

  • Common switching elements include MOSFETs, IGBTs, and SCRs.

  • RRP Electronics will manufacture high-quality, automotive-grade power modules using Silicon Carbide-based high-performance power devices.