Maharashtra’s First
Operational OSAT Facility.
Expanding Forward.
Driving India’s semiconductor momentum with scalable, next-gen packaging and testing capabilities from the heart of Maharashtra.
Packaging Services
QFN Packages
Quad Flat No-Lead (QFN) is a surface-mount IC package with no external leads, offering excellent thermal and electrical performance in a compact form.
Compact & lightweight
Suited for space-constrained designs.
Thermal Performance
Enables smooth operations.
Applications
IoT, mobile, RF, consumer, automotive & industrial systems
Industries We Power
The Future, Powered by RRP
Telecommunication
Ultra-fast, low-latency network processing.
Industrial
Smart grids, renewable energy integration, efficient power distribution.
Automotive & EVs
Smart chips for self-driving cars & battery management.
Medical & Healthcare
Next-gen diagnostic & wearable tech.
Commercial
Advanced IoT solutions, smart retail systems, intelligent automation.
Advanced Computing
Future-ready computing for complex applications.
Inside the
OSAT Process
From wafer to package, see how our world-class OSAT process delivers precision, performance, and scalability at every stage of chip assembly and testing.
Our People. Our Principles.
Our Progress.
Young Talent
Employment Generation
Empowering Women
